Description
White thermal paste heat sink compound Silicone base tube 100ML
This chemical compound has the ability to conduct heat. It is frequently employed as an interface between heat sources, such as high-power semiconductor devices, and the heat sink. Thermal paste’s primary function is to remove any air gaps or voids from the interface region in order to enhance heat dissipation and transfer. The link between the heat sink and the heat source is not strengthened mechanically by this paste. For the heat sink to be held in place, it must be combined with a mechanical fixing mechanism, such as screws. And spread the thermal paste to apply pressure.
Features:-
- Eliminate air gaps between the heat sink and heat source
- Maximize the heat transfer or dissipation
- Also, Eliminates the risk of melting of the heat sink
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